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Chip Bead Array
Chip Bead Array
Type:
EXC28B
Features
Space saving SSOP package (0.5 mm pitch) compatibility Small size and lightweight Type: EXC28BB Suitable for high speed signals (over 50 MHz) Excellent cross talk characteristics (100 MHz:<-25 dB) Type: EXC28BA Reduces waveform ringing noise Excellent cross talk characteristics (100 MHz:<-30 dB)
Recommended Applications
Small digital equipment such as PCs, printers, HDD, DVD-ROMs, CD-ROMs, LCDs. Digital audio and video equipment such as DSC, DVC, CD Players, DVD Players, MD Players. Electronic musical instruments, and other digital equipment.
Explanation of Part Numbers
1 2 3 4 5 6 7 8 9 10 11 12
E
X
Product Code
C
2
Size
8
B
B
1
2
1
U
Form Suffix
Type Characteristics
Nominal Impedance
Noise Filter
Chip size 1005 mm x4 Array
B
Multilayer Chip bead
A Ringing Suppression Type B High Speed Signal Type
The first two digits are significant figure of impedance value and the third one denotes the number of zeros following
Code U
Packing Embossed Carrier Taping
Construction
Dimensions in mm (not to scale)
Ferrite Core A
B
D C E F
Inner Conductor
Electrode
Type (inches)
Dimensions (mm)
A
B
C
D
E
F
Mass (Weight) [mg/pc.] 5.2
EXC28B 1.000.15 2.00.2 (0804)
0.50.1 0.200.15 0.50.1 0.250.10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Array
Ratings
Type BA Part Number EXC28BA121U EXC28BA221U EXC28BB121U EXC28BB221U Impedance ( ) at 100MHz tol.(%) 120 220 120 220 25 100 Rated Current (mA DC) DC Resistance ( ) max. 0.5 0.7 0.5 0.7
BB
Impedance Characteristics (Reference Data) Measured by HP4291A
EXC28BA121U (2010)
400 350 | Z| ,R,X( ) | Z| ,R,X( ) 300 250 200 150 100 50 0 1 10 X 100 1000 Frequency(MHz) 10000 Z R
EXC28BB121U (2010)
400 350 300 250 200 150 100 50 0 1 10 100 1000 Frequency(MHz) 10000 X Z R
EXC28BA221U (2010)
400 350 | Z| ,R,X( ) 250 200 150 100 50 0 1 10 100 1000 Frequency(MHz) 10000 X Z R 300
EXC28BB221U (2010)
400 350 | Z| ,R,X( ) 300 250 200 150 100 50 0 1 10 100 1000 Frequency(MHz) 10000 X Z R
Z
: Impedance
R : Resistance
X : Reactance
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Array
Circuit Configuration
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
Packaging Methods (Taping)
Standard Quantity Part Number EXC28B U Kind of Taping Embossed Carrier Taping Pitch (P1) 4 mm Quantity 5000 pcs./reel
Embossed Carrier Taping
Taping Reel
T
t1
Sprocket hole
D0 A B
Compartment C E B W t
F
W
D E
t2 Chip component
P1
P2
P0 Tape running direction A
Embossed Carrier Dimensions (mm) Part Number EXC28B A B W F E P1 P2 2.00.1 P0 4.00.1 D0 t1 t2
U 1.200.15 2.250.15 8.00.2
3.50.1 1.750.10 4.00.1
1.50.1 0.200.05 0.90.1
Standard Reel Dimensions (mm) Part Number EXC28B U A 180
0 -3.0
B 60.01.0
C 13.00.5
D 21.00.8
E 2.00.5
W 9.00.3
T 11.41.5
t 1.20.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Bead Array
Recommended Land Pattern Design
E F E B F E F E Dimension (mm) A D B C A C D E D F 1.4 1.75 0.4 0.5 0.25 0.25
Recommended Soldering Conditions
Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use.
Peak Temperature Preheating Heating
For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 10 C Time 60 s to 120 s 30 s to 40 s max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 C to 170 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s
Time
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder each electrode for 3 seconds or less. Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog. 1. When possible, do not mount Chip Bead Array (hereafter called the bead arrays) by flow soldering. It is highly possible that flow soldering may cause bridges between the electrodes. 2. Use rosin-based flux or halogen-free flux. 3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 4. Do not apply shock to the bead arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the bead arrays. Handle with care. 5. Store the bead arrays in a location with a temperature ranging from -5 C to +40 C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 6. Use the bead arrays within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
* When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment (except ESD Suppressors) These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). * Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. * Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 C to +40 C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 C to +40 C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight
Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English.
Jan. 2008
- EL113 -

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